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US 8,076,827 B2Granted
Acoustic wave device and method for fabricating the same
AssigneeTaiyo Yuden Co., Ltd.
InventorsYasuyuki Saitou, Osamu Kawachi, Kaoru Sakinada, Yasuyuki Oda
Life of this patent
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Abstract
An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.
Claims15
An acoustic wave device comprising:
- a substrate;
- a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate;
- a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate;
- and
- a metal seal part that seals the device chip,
- wherein the first insulation layer does not touch any side surfaces of the device chip and the metal seal part surrounds the side surfaces of the device chip.
3 more elements
An acoustic wave device comprising:
- a substrate;
- a device chip that has a piezoelectric substrate and is flip-chip mounted on an a surface of the substrate;
- and
- a metal seal part that seals the device chip and does not touch any side surfaces of the device chip,
- wherein the metal seal part surrounds the side surfaces of the device chip and a void is formed between the side surface of the device chip and the metal seal part.
2 more elements
An acoustic wave device comprising:
- a substrate;
- a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate;
- a metal seal part that seals the device chip and does not touch any side surfaces of the device chip;
- a metal pattern that is provided on the surface of the substrate and is located further out than a region in which the device chip overlaps the substrate;
- and
- an insulation layer that is provided on the surface of the substrate and is provided in at least a part of an area between the region and the metal pattern,
- wherein the metal seal part surrounds the side surface of the device chip and the metal pattern is connected to the metal seal part.
4 more elements
A method for fabricating an acoustic wave device comprising:
- flip-chip mounting a device chip having a piezoelectric substrate on a surface of a substrate;
- providing a first insulation layer on a surface of the device chip opposite to another surface that faces the substrate, the first insulation layer having a dielectric constant smaller than that of the piezoelectric substrate, and wherein the first insulation layer does not touch any side surfaces of the device chip;
- and
- sealing the device chip with a metal seal part that is provided on the surface of the substrate and is located further out than a region in which the device chip overlaps the substrate, the metal pattern being connected to the metal seal part,
- wherein the metal seal part does not touch any of the side surfaces of the device chip and surrounds the side surfaces of the device chip.
2 more elements
Dependencies are inferred from the claim text.