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US 8,076,785 B2Granted
Semiconductor device
AssigneeFujitsu Semiconductor Limited
InventorsTakao Nishimura, Yoshikazu Kumagaya, Akira Takashima, Kouichi Nakamura, Kazuyuki Aiba
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Abstract
A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
Claims1
A semiconductor device, comprising:
- a semiconductor element having a main surface where an outside connection terminal pad is provided;
- wherein the semiconductor element is connected to, via a plurality of convex-shaped outside connection terminals and a connection member, a conductive layer on a supporting board, the plurality of convex-shaped outside connection terminals being provided on the outside connection terminal pad, the connection member being formed between the outside connection terminal pad on the semiconductor element and the conductive layer on the supporting board;
- the connection member includes solder and completely and commonly covers the convex-shaped outside connection terminals;
- and
- the convex-shaped outside connection terminals have a structure where a convex-shaped part projecting from a base part is formed in a body with the base part.
2 more elements
Dependencies are inferred from the claim text.