US 8,076,782 B2 · Substrate for mounting IC chip

Abstract

An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

Claims7

Dependent claims

A substrate for mounting an IC chip comprising:

an insulating substrate having a first surface and a second surface on an opposite side of the first surface;
a first built-up structure formed on the first surface of the insulating substrate and comprising a conductor circuit and an interlaminar insulating layer;
a second built-up structure formed on the second surface of the insulating substrate and comprising a conductor circuit and an interlaminar insulating layer;
a solder resist layer formed as an outermost layer over the first built-up structure;
an optical element mounted over the solder resist layer;
a resin layer formed between the solder resist layer and the optical element;
and
an optical path for transmitting optical signal to or from the optical element and penetrating though the insulating substrate, first built-up structure, second built-up structure and solder resist layer.

5 more elements

Dependencies are inferred from the claim text.

Substrate for mounting IC chip

Life of this patent

Substrate for mounting IC chip

Life of this patent

Abstract

Claims7