Integrated circuit package having security feature and method of manufacturing same
AssigneeIntel Corporation
InventorsDhruv P. Bhate, Sergei L. Voronov
Life of this patent
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Abstract
An integrated circuit package comprises a package substrate (210, 410), an electrically insulating material (220, 420) adjacent to the package substrate, and a mark (230, 420) on the electrically insulating material. The mark is such that a visual contrast between the mark and the electrically insulating material is maximized when the mark and the electrically insulating material are exposed to coaxial illumination. In one embodiment the electrically insulating material over the package substrate has a first surface roughness and a mark on the solder resist material has a second surface roughness that is no more than approximately twenty times greater than the first surface roughness.
Claims10
An integrated circuit package comprising:
- a package substrate;
- a solder resist material adjacent to the package substrate;
- and
- a mark on the solder resist material, wherein the mark is such that a visual contrast between the mark and the solder resist material is maximized when the mark and the solder resist material are exposed to coaxial illumination.
An integrated circuit package comprising:
- a package substrate;
- a solder resist material over the package substrate, the solder resist material having a first surface roughness;
- and
- a mark on the solder resist material, the mark having a second surface roughness, wherein the second surface roughness is no more than twenty times greater than the first surface roughness.
Dependencies are inferred from the claim text.