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US 8,076,773 B2Granted
Thermal interface with non-tacky surface
AssigneeThe Bergquist Company
InventorsRadesh Jewram, Sanjay Misra
Life of this patent
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Abstract
A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.
Claims3
A conformable thermal interface member, comprising:
- a body having:
- (a) a bulk layer having a modulus of less than about 106 Pa, and a thermal conductivity of at least about 0.5 W/m·K;
- and
- (b) a surface layer disposed on said bulk layer, said surface layer defining an exterior engagement surface of said body and having:
- (i) a maximum cross sectional thickness of less than about 10 μm;
- (ii) a thermal conductivity along at least a thickness dimension of said surface layer of at least about 50 W/m·K;
- and
- (iii) a melting point exceeding a solder reflow temperature.
5 more elements
Dependencies are inferred from the claim text.