Semiconductor device and manufacturing method of semiconductor device
AssigneeFujitsu Semiconductor Limited
InventorsTakao Nishimura, Yoshikazu Kumagaya
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Abstract
A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.
Claims15
A semiconductor device, comprising:
- a semiconductor element;
- a plate member disposed opposite to an electronic-circuit forming portion of said semiconductor element;
- and
- an elastic body arranged in a compressed state between said semiconductor element and said plate member, wherein
- said elastic body includes at least one first protruding portion having an acute angle shape at one end in an extension direction of said elastic body, said first protruding portion being formed opposite to said electronic-circuit forming portion of said semiconductor element, and
- said semiconductor element and said plate member are fastened by an adhesive agent.
Dependencies are inferred from the claim text.