Electrical shielding in stacked dies by using conductive die attach adhesive

A method for packaging an integrated circuit having a plurality of die including a first device and an additional device, and having a grounded substrate, the method comprising:

• attaching a first device die onto a substrate;
• applying an insulating material on the first device die;
• attaching an additional device die onto the insulating material;
• and
• using a conductive adhesive to bond the first device die to the additional device die at predetermined ground connections on the first device die to predetermined ground connections on the additional device die, and bonding the predetermined ground connections to ground nodes of the substrate.

A method for packaging an integrated circuit having a plurality of die including a first device and at least one additional device, the method comprising:

• attaching a first device die onto a substrate;
• applying a conductive adhesive on the first device die;
• and
• attaching an additional device die onto the conductive adhesive, wherein the conductive adhesive connects the first device die at predetermined ground connections to predetermined ground connections on the additional device die.