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US 8,076,759 B2Granted
Semiconductor package with a controlled impedance bus and method of forming same
AssigneeRambus Inc.
InventorsNader Gamini, Donald V. Perino
Life of this patent
Estimating the term…
Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
Claims20
A semiconductor package comprising:
- a plurality of semiconductor devices each including:
- a first bypass pad and a second bypass pad interconnected by a bypass lead, and connection pads;
- the plurality of semiconductor devices including an inoperative device and a plurality of operational devices;
- and
- an electrical connector connecting the first bypass pad of the inoperative device to a respective connection pad of a first device of the plurality of operational devices.
2 more elements
A semiconductor package comprising:
- a plurality of semiconductor devices, each comprising a bypass lead and a plurality of connection pads;
- the plurality of semiconductor devices including a flawed device and a plurality of functional devices, including first and second functional devices disposed near to the flawed device;
- a plurality of electrical connections that electrically connect a respective connection pad of the first functional device to a respective connection pad of the second functional device via the bypass lead of the flawed device.
A semiconductor package, comprising:
- a plurality of semiconductor devices including an operative semiconductor device and an inoperative semiconductor device, wherein each of the plurality of semiconductor devices comprises:
- at least two bypass pads interconnected by a bypass lead, and a set of input/output pads;
- and
- a plurality of electrical connections, each electrically coupling a respective one of the input/output pads on the operational semiconductor device to a respective bypass pad on the inoperative semiconductor device.
1 more element
Dependencies are inferred from the claim text.