Micromechanical component and method for producing a micromechanical component
AssigneeRobert Bosch GmbH
InventorsPeter Schmollngruber, Hans Artmann, Thomas Wagner
Life of this patent
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Abstract
A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside in a contact region. The substrate has at least one contact hole in the contact region, which extends into the substrate, starting from the backside.
Claims7
A micromechanical component, comprising:
- a substrate having a front side and a back side, wherein the back side of the substrate defines a back side of the micromechanical component;
- and
- a functional pattern located on a front side of the micromechanical component, the functional pattern being electrically contacted to the back side of the substrate in a contact region;
- wherein:
- the substrate has at least one contact hole and a plurality of plated-through holes in the contact region, the contact hole extending from the back side of the substrate towards a front side of the micromechanical component, the plurality of plated-through holes coated with an electrically conductive material to connect the contact hole to the front side of the micromechanical component through each of the plated-through holes at a common electric potential;
- a mechanically stable diaphragm is situated between the contact hole and the front side of the micromechanical component;
- an epitaxial layer is provided on the front side of the substrate, and the contact hole extends at least up to the epitaxial layer;
- and
- between the substrate and the epitaxial layer, an oxide layer is situated at least in the contact region.
A method for producing a micromechanical component having a functional pattern located on a front side of the micromechanical component, a mechanically stable diaphragm, a plurality of plated-through holes, and a contact hole, the method comprising:
- producing the contact hole starting from a back side of a substrate corresponding to a back side of the micromechanical component towards a front side of the micromechanical component by a first trench etching process, the etching process being stopped, in a controlled manner, at an epitaxial layer, whereby the mechanically stable diaphragm remains between the end of the contact hole and the front side of the micromechanical component;
- producing a plurality of plated-through holes by a second etching process and coating the plurality of plated-through holes with an electrically conductive material to connect the contact hole to the front side of the micromechanical component through each of the plated-through holes at a common electric potential;
- and
- providing an electrical contact between the functional pattern and the backside of the micromechanical component at a contact region, wherein the electrical contact extends all the way through the diaphragm.
Dependencies are inferred from the claim text.