Semiconductor device and method for manufacturing the same
AssigneePanasonic Corporation
InventorsMasashi Hayashi, Shin Hashimoto
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Abstract
A semiconductor device according to the present invention comprises a silicon carbide semiconductor substrate (1) including a silicon carbide layer (2); a high-concentration impurity region (4) provided in the silicon carbide layer (2); an ohmic electrode (9) electrically connected with the high-concentration impurity region (4); a channel region electrically connected with the high-concentration impurity region; a gate insulating layer (14) provided on the channel region; and a gate electrode (7) provided on the gate insulating layer (14). The ohmic electrode (9) contains an alloy of titanium, silicon and carbon, and the gate electrode (7) contains titanium silicide.
Claims15
A semiconductor device, comprising:
- a silicon carbide semiconductor substrate including a silicon carbide layer;
- a high-concentration impurity region provided in the silicon carbide layer;
- an ohmic electrode electrically connected with the high-concentration impurity region;
- a channel region being in direct contact with the high-concentration impurity region;
- a gate insulating layer provided on the channel region;
- and
- a gate electrode provided on the gate insulating layer;
- wherein the ohmic electrode contains an alloy of titanium, silicon and carbon, and the gate electrode contains titanium silicide,
- wherein the ohmic electrode includes a reaction layer formed of the alloy of titanium, silicon and carbon;
- and
- the reaction layer in the ohmic electrode is in direct contact with the high-concentration impurity region.
Dependencies are inferred from the claim text.