Power module assembly with reduced inductance

A device comprising:

• a first conductive substrate;
• a second conductive substrate;
• a first power semiconductor component that has a first thickness and is electrically coupled to said first conductive substrate;
• a second power semiconductor component that has a second thickness and is electrically coupled to said second conductive substrate;
• a positive terminal electrically coupled to said first conductive substrate;
• a negative terminal electrically coupled to said second power semiconductor component via a conductor that extends generally along a connection direction;
• and
• an output terminal electrically coupled to said first power semiconductor component and said second conductive substrate,
• wherein said positive and negative terminals, said first and second power semiconductor components, and said first and second conductive substrates are incorporated into a common circuit loop and are configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness, and
• wherein said first and second power semiconductor components are respectively disposed on opposing sides of said positive terminal and of said negative terminal, and said first and second power semiconductor components are generally disposed so as to be aligned along the connection direction.