Back to results
US 8,076,692 B2Granted
LED package
AssigneeSamsung LED Co., Ltd.
InventorsHyung Kun Kim, Ho Sun Paek, Suk Ho Jung, Hak Hwan Kim, Young Jin Lee
Life of this patent
Estimating the term…
Abstract
The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
Claims12
An LED package comprising:
- a heat discharge body including:
- a circular top surface;
- a cylindrical side surface;
- a bottom surface;
- a plurality of radially protruding heat discharge fins disposed in a vertical direction on the cylindrical side surface and
- a molding material disposed on a space between the plurality of discharge fins on the cylindrical side surface and on top and bottom surfaces of the plurality of discharge fins in a vertical direction;
- a package body which is received on a top surface of the heat discharge body and includes a cavity;
- a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof;
- and
- an LED chip mounted inside the cavity,
- wherein the molding material is filled in portions of the molding material filled spaces to expose ends of the heat discharge fins.
8 more elements
Dependencies are inferred from the claim text.