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US 8,076,691 B2Granted
Package for light emitting device and method for packaging the same
AssigneeLG Innotek Co., Ltd.
InventorJun Seok Park
Life of this patent
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Abstract
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
Claims12
A light emitting apparatus comprising:
- a board;
- a light emitting device chip on the board;
- an electric circuit layer electrically connected to the light emitting device chip;
- a first member disposed on the board adjacent to the light emitting device chip, the first member guiding a resin material to define a perimeter of the resin material;
- a resin member formed by the resin material guided by the first member, the resin member disposed around the light emitting device chip;
- a lens having a hollow structure and accommodating the light emitting device chip and the first member;
- and
- a second member disposed around the light emitting device chip, the second member combined to the lens,
- wherein the lens is spaced from the light emitting device chip so as to form a space between itself and the light emitting device chip,
- wherein the board comprises an entire flat upper surface.
7 more elements
Dependencies are inferred from the claim text.