Semiconductor light emitting device
AssigneeRohm Co., Ltd.
InventorsYasunori Hata, Masahiko Kobayakawa
Life of this patent
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Abstract
A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.
Claims21
A semiconductor light emitting device comprising:
- a semiconductor light emitting element;
- a lead electrically connected to the semiconductor light emitting element;
- and
- a resin package covering the semiconductor light emitting element and part of the lead, the resin package including a lens facing the semiconductor light emitting element;
- wherein the lead includes an exposed portion extending outside of the resin package, the exposed portion comprising a first mount surface and a second mount surface, the first mount surface having a normal line parallel to an optical axis of the lens and being disposed behind the resin package in a direction along the optical axis of the lens, the second mount surface having a normal line perpendicular to the optical axis of the lens and being spaced further from the optical axis of the lens than the resin package is,
- wherein the first mount surface and the second mount surface are connected to each other via a strip portion.
Dependencies are inferred from the claim text.