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US 8,076,670 B2Granted
LED with conductively joined bonding structure
AssigneeCree, Inc.
InventorsDavid Beardsley Slater, Jr., John Adam Edmond
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Abstract
An LED is disclosed that includes a conductive submount, a bond pad having a total volume less than 3×10−5 mm3 conductively joined to the submount, a first ohmic contact on the bond pad opposite from the submount, an epitaxial region comprising at least a p-type layer and an n-type layer on the first ohmic contact, and an electrode to the epitaxial region opposite from the first ohmic contact.
Claims18
An LED chip comprising:
- a conductive submount (24);
- a bond pad (31) having a total volume less than 3×10−5 mm3 conductively joined to said submount;
- a first ohmic contact (18) on said bond pad opposite from said submount;
- an epitaxial region (12) comprising at least a p-type layer (16) and an n-type layer (14) on said first ohmic contact;
- and
- a second ohmic contact (22) to said epitaxial region opposite from said first ohmic contact.
3 more elements
Dependencies are inferred from the claim text.