Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method
AssigneeJumatech GmbH
InventorMarkus Wölfel
Life of this patent
Estimating the term…
Abstract
A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.
Claims25
Method for welding at least one wire conductor to electrical contact points disposed on a contact area of a conductive film to provide a wire-carrying conductive film adapted for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the we conductor being greater than the thickness of the conductive film, the method comprising (a) conducting the welding in a welding area of the conductive film;
- (b) contacting the conductive film at least during the welding with a thermal isolation plate having a thermal conductivity which is lower than that of the conductive film;
- (c) removing the wire-carrying conductive film from the thermal isolation plate and then connecting the wire-carrying conductive film to a circuit board support;
- and (d) forming a printed circuit board by partially etching away the conductive film connected to the circuit board support to electrically isolate the electrical contact points.
Method for the continuous laying of an insulated conductor between electrical contact points arranged on a conductive film by means of a numerically controlled device, the method comprising at least the following steps:
- a) Stripping the insulation off of the conductor at a connection section intended for connection to a beginning connection point;
- b) Moving the conductive film relative to at least the connecting section of the conductor, in order to position the connecting section of the conductor at the beginning connection point on the conductive film;
- c) Connecting the connecting section of the conductor to the beginning connection point;
- d) Moving the conductor relative to the conductive film while feeding a conductor length that is to be laid, in order to position a further connection section of the conductor at a further connection point on the conductive film;
- e) Stripping the insulation off of the connecting section of the conductor positioned at the further connection point;
- f) Connecting the connecting section of the conductor to the further connection point;
- g) Repeating steps d) to f) until such a time as the end connection point has been reached;
- h) Separating the laid length of conductor to free the conductive film for further movement;
- and
- i) After step g), transferring the conductive film to a circuit board support to form a printed circuit board by means of partially etching away the conductive film connected to the circuit board support to electrically isolate the areas forming the electrical contact points.
Dependencies are inferred from the claim text.