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US 8,076,592 B2Granted
Electromagnetic interference preventing module
AssigneeQuanta Computer Inc.
InventorsWen-Cheng Lin, Mao-Chen Hsiao
Life of this patent
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Abstract
An electromagnetic interference preventing module is provided. The module includes a metal pad that is disposed on a circuit board. The metal pad includes a soldering portion and a grounding portion that are connected to each other. At least one fixing lug of a connector is soldered to the soldering portion. At least one protrusion of a grounding housing is in contact with the grounding portion, so as to electrically connect the connector with the grounding housing.
Claims20
An electromagnetic interference preventing module comprising:
- a circuit board comprising a first surface, an opposite second surface and at least one soldering hole that passes through the circuit board from the first surface to the second surface;
- a metal pad disposed on the first surface and comprising:
- a soldering portion surrounding the soldering hole;
- and
- a grounding portion connecting with the soldering portion;
- a connector disposed on the second surface and comprising at least one fixing lug, wherein the fixing lug penetrates through the soldering hole and is soldered to the soldering portion;
- and
- a first grounding housing comprising a first protrusion, which is in contact with the grounding portion on the first surface, to electrically connect with the connector.
5 more elements
Dependencies are inferred from the claim text.