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US 8,076,591 B2Granted
Circuit boards
AssigneeBAE SYSTEMS plc
InventorsMartin Joseph Agnew, Gary David Panaghiston, Murray Jerel Niman, Nicholas Chandler
Life of this patent
Estimating the term…
Abstract
The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.
Claims19
A circuit board structure, comprising:
- a first multilayered circuit board unit;
- a second multilayered circuit board unit aligned along respective edge portions with the first multilayered circuit board, each multilayered circuit board unit including a first outer radio frequency (RF) screening layer and a layer including a circuit board;
- and
- an interconnect, extending alongside and spaced apart from said edge portions, at least part of which is formed separately from the first and second circuit board units, providing an electrical connection between the first and second circuit board units, the interconnect including a laminate having a first electrically conductive layer and a further layer, the first electrically conductive layer electrically connecting the first outer RF screening layer of each of the first and second multilayered circuit board units;
- and
- wherein each of the first multilayered circuit board unit and the second multilayered circuit board unit includes a second outer screening layer such that the layer including a circuit board is disposed between the first outer screening layer and the second outer screening layer,
- wherein the interconnect is a laminate including a second electrically conductive layer such that the further layer forms an intermediate layer disposed between the first electrically conductive layer and the second electrically conductive layer, and
- wherein the second electrically conductive layer electrically connects the second outer screening layer of each of the first multilayered circuit board unit and the second multilayered circuit board unit.
5 more elements
A circuit board structure, comprising:
- three or more spaced apart multilayered circuit board units, each of which includes first and second outer screening layers and a circuit board located between the first and second outer screening layers and insulated therefrom;
- and
- an interconnect connected between any two of the circuit board units, the interconnect including a laminate having a first electrically conductive layer, a second electrically conductive layer and an intermediate layer between the first electrically conductive layer and the second electrically conductive layer, the first electrically conductive layer electrically connecting the first outer screening layers of said any two circuit board units, and the second electrically conductive layer linking the second outer screening layers of said any two circuit board units.
A circuit board structure, comprising:
- three or more multilayered circuit board units, each of which includes first and second outer screening layers and a circuit board located between the first and second outer screening layers and insulated therefrom, and
- an interconnect including a laminate having a first electrically conductive layer, a second electrically conductive layer and an intermediate layer between the first electrically conductive layer and the second electrically conductive layer, the first electrically conductive layer electrically connecting the first screening layers of at least three of said multilayered circuit board units, and the second electrically conductive layer linking the second screening layer of said at least three of said multilayered circuit board units.
A circuit board structure, comprising:
- a plurality of multilayer circuit board units arranged in a stack, each circuit board unit including one or more circuit boards and upper and lower outer screening layers above and below and insulated from said one or more circuit boards such that a lower screening layer of one circuit board unit is in electrical contact with an upper screening layer of an adjacent circuit board unit, with the circuit boards being spaced from one another, and an interconnect external to said stack electrically connecting at least one set of adjacent ones of said upper and lower screening layers to other sets of adjacent screening layers.
Dependencies are inferred from the claim text.