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US 8,076,590 B2Granted
Printed circuit board
AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.
InventorsHui-Chen Zhao, Qing-Lin Zhou
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a first signal via, a second signal via, and a first ground via. A distance between the first ground via and the first signal via is substantially equal to a distance between the first ground via and the second signal via.
Claims15
A printed circuit board (PCB), comprising:
- a first signal via;
- a second signal via;
- a first ground via;
- a second ground via;
- a first differential trace comprising a first segment and a second segment;
- and
- a second differential trace comprising a third segment and a fourth segment;
- wherein a distance between the first ground via and the first signal via is substantially equal to a distance between the first ground via and the second signal via;
- a distance between the second ground via and the first signal via is substantially equal to a distance between the second ground via and the second signal via;
- the first ground via and the second ground via each comprises an upper cap positioned on a top layer of the PCB, and a lower cap positioned on a bottom layer of the PCB;
- the upper cap of the first ground via is positioned between the first and third segments;
- and the lower cap of the second ground via is positioned between the second and fourth segments.
9 more elements
A printed circuit board (PCB), comprising:
- a first signal via;
- a second signal via;
- a first ground via;
- a first differential trace comprising a first segment and a second segment;
- and
- a second differential trace comprising a third segment and a fourth segment;
- wherein a distance between the first ground via and the first signal via is substantially equal to a distance between the first ground via and the second signal via;
- the first ground via comprises an upper cap positioned on a top layer of the PCB, and a lower cap positioned on a bottom layer of the PCB;
- and the upper cap of the first ground via is positioned between the first and third segments.
6 more elements
Dependencies are inferred from the claim text.