Printed circuit board for harsh environments

A printed circuit board for use on a rotating part of a gas turbine engine and being capable of withstanding the ultra high G-forces and the ultra high temperature of said gas turbine engine, said printed circuit board comprising:

• a high temperature capable ceramic substrate having a plurality of cavities formed therein for receiving components of a circuit and gold conductors embedded in said substrate for electrically connecting said components together to form said circuit;
• and,
• select ones of said cavities having gold paste on the bottom thereof for attaching said components;
• and
• at least one wall of said cavities upstream of said G-forces being disposed to support said respective components when subjected to said G-forces.

In a telemetry system for use in a high temperature and high G-force environment, a circuit module affixed to a moving part and disposed for receiving information sensed about a condition of said part and transmitting said received information to a receiver external to said environment, said circuit module being adapted for the high temperature and high G-force environment and comprising:

• a high-temperature resistant package adapted for attachment to said part;
• a ceramic substrate for supporting both active and passive components of a circuit, said substrate comprising a plurality of cavities formed therein for receiving the active or passive components of said circuit, and conductors for electrically connecting said components together to complete said circuit;
• and,
• said cavities having respective walls upstream of said G-force and being disposed to support said respective components in compression when subjected to said G-force.

A printed circuit board capable of withstanding an ultra high G-force as in a rotating component of a gas turbine, said printed circuit board comprising:

• a high temperature capable ceramic substrate having one or more cavities a cavity, wherein said cavity has a wall upstream of a G-force;
• a component of a circuit disposed within the cavity and attached to a bottom of the cavity and the upstream wall, wherein the upstream wall supports said component in compression when subjected to said G-force;
• a plurality of discrete conductors on a surface of the substrate and each conductor having a terminus adjacent to the cavity;
• and,
• a plurality of bonding conductors, each bonding conductor extending between a contact pad on a the component and a respective conductor terminus on the surface of the substrate.