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US 8,076,586 B2Granted
Heat conduction from an embedded component
AssigneeImbera Electronics Oy
InventorsRisto Tuominen, Petteri Palm
Life of this patent
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Abstract
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
Claims19
A circuit-board construction, comprising:
- an insulating-material layer;
- at least two conductor pattern layers;
- at least one component inside the insulating-material layer;
- electrical vias to connect the component electrically to at least one of the conductor pattern layers;
- and
- at least one thermal via in the insulating-material layer in the vicinity of the component, wherein
- at least one electrical via connected to said component and at least one thermal via in the vicinity of said component are situated on a first surface of the insulating-material and are formed from the same solderless material,
- at least one of the conductor pattern layers is situated on the side of the first surface of the insulating-material layer and at least one other of the conductor pattern layers is situated on the side of a second surface, opposite to the first surface, of the insulating-material layer, and
- at least one thermal via is connected to the conductor pattern layer on the side of the first surface and at least one other thermal via is connected to the conductor pattern layer on the side of the second surface.
6 more elements
Dependencies are inferred from the claim text.