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AssigneeDaishinku Corporation
InventorsKazuhiko Kumatani, Yoshihisa Takano, Naotoshi Nakamura, Mototsugu Ogasa, Takashi Nakamura, Minoru Iizuka
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There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.
An electronic component package, in which an electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base with a gap between the metal base and the metal cap of 3 to 15 μm, and the metal base and the metal cap are resistance welded to hermetically seal the electronic component element,
Dependencies are inferred from the claim text.