Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, metal layer-coated resin film using the same, and method for producing metal layer-coated resin film

Abstract

The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.

Dependencies are inferred from the claim text.