Methods for causing fluid to flow through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device components
AssigneeMicron Technology, Inc.
InventorRoss S. Dando
Life of this patent
Estimating the term…
Abstract
A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.
Claims39
A method for removing obstructions or irregularities from surfaces of at least one aperture that extends substantially through a substrate, comprising:
- positioning the substrate substantially along a boundary within a pressurizable chamber;
- and
- generating a pressure differential across the boundary, the pressure differential causing fluid on a first side of the pressurizable chamber at a first side of the boundary to flow into the at least one aperture of the substrate toward a second side of the pressurizable chamber at a second side of the boundary.
A method for removing obstructions or irregularities from surfaces of at least one aperture that extends substantially through at least one substrate, comprising:
- positioning the at least one substrate substantially along a boundary within a chamber to substantially isolate a first side of the chamber from a second side of the chamber;
- limiting fluid communication between the first side and the second side of the chamber to communicate through the at least one aperture that extends substantially through the substrate;
- and
- generating a differential across the boundary to initiate a flow of a fluid from the first side of the chamber through the at least one aperture and into the second side of the chamber, the fluid comprising a material for removing obstructions or irregularities within the at least one aperture.
A method for removing obstructions or irregularities from surfaces of at least one aperture that extends substantially through at least one substrate, comprising:
- positioning the at least one substrate substantially along a boundary within a chamber, the boundary dividing the chamber into a first side and a second side;
- and
- generating a differential across the boundary to initiate a flow of a wet etchant from the first side of the chamber through the at least one aperture and into the second side of the chamber.
Dependencies are inferred from the claim text.