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US 8,076,238 B2Granted
Electronic device and method for production
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Matthias Stecher
Life of this patent
Estimating the term…
Abstract
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.
Claims14
A method for producing a device comprising:
- applying a first mask to an integrated component;
- electroplating an electrically conductive first layer, wherein the first layer is composed of or contains copper or a copper alloy, and wherein the first layer is defined by the first mask arranged on the component;
- depositing a second layer after the electroplating, wherein the second layer is composed of or contains aluminum or an aluminum alloy, or wherein the second layer is composed of or contains a metal from the fourth to sixth group in the periodic table, or wherein the second layer is composed of or contains a metal and phosphorus;
- and
- connecting the integrated component by pressing a connection apparatus through the second layer to the first layer,
- wherein the second layer is structured by removal of the first mask using a lift-off process that removes a portion of the second layer.
3 more elements
A method for producing a device comprising:
- applying a first mask to an integrated component;
- electroplating an electrically conductive first layer, wherein the first layer is composed of or contains copper or a copper alloy, and wherein the first layer is defined by the first mask arranged on the component;
- and
- depositing a second layer after the electroplating, wherein the second layer is composed of or contains aluminum or an aluminum alloy, or wherein the second layer is composed of or contains a metal from the fourth to sixth group in the periodic table, or wherein the second layer is composed of or contains a metal and phosphorus,
- wherein the second layer is structured with a further mask, and
- wherein the further mask is applied with the first mask still arranged on the component.
3 more elements
A method for producing a device comprising:
- applying a first mask to an integrated component;
- electroplating an electrically conductive first layer, the first layer comprising copper and defined by the first mask arranged on the component;
- depositing a second layer over the first layer, the second layer comprising aluminum;
- tructuring the second layer with a second mask or structuring the second layer by removal of the first mask using a lift-off process that removes a portion of the second layer;
- and
- connecting the integrated component by pressing a connection apparatus through the second layer to the first layer.
3 more elements
A method for producing a device comprising:
- applying a first mask to an integrated component;
- electroplating an electrically conductive first layer, the first layer comprising copper and defined by the first mask arranged on the component;
- depositing a second layer over the first layer, the second layer comprising aluminum;
- and
- structuring the second layer with a second mask,
- wherein structuring the second layer with the second mask comprises structuring the second layer with the second mask with the first mask still arranged on the component.
3 more elements
Dependencies are inferred from the claim text.