Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure

A method for forming a semiconductor device, comprising:

• forming a via structure through at least one dielectric layer and at least a portion of a substrate;
• forming a protective buffer layer onto the via structure;
• and
• forming a conductive structure for an integrated circuit over said substrate after forming the via structure and the buffer layer, with said conductive structure not being formed over the via structure,
• wherein said conductive structure is formed through said at least one dielectric layer that has been formed before and under said protective buffer layer.