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US 8,076,233 B2Granted
Method of forming electrode connecting portion
AssigneeFujitsu Limited
InventorsKuniko Ishikawa, Norio Kainuma, Kenji Kobae
Life of this patent
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Abstract
A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.
Claims6
A manufacturing method for an electrode connecting portion, comprising:
- covering an electrode forming surface with a solder sheet;
- rolling a heating roller on the solder sheet that covers the electrode forming surface;
- and
- removing residual solder sheet material after the heating roller has passed over the solder sheet,
- wherein the solder sheet has an electrically insulative cover sheet.
2 more elements
A manufacturing method for an electrode connection portion, comprising:
- covering an electrode forming surface with a solder sheet;
- rolling a heating roller on the solder sheet that covers the electrode forming surface;
- and
- removing residual solder sheet material after the heating roller has passed over the solder sheet,
- wherein a heating temperature of the hot press roller is set at a temperature higher than or equal to a melting point of solder of the solder sheet, and
- when the solder sheet is removed, a heating temperature of a take-up roller that takes up the residual solder sheet material is set at a temperature lower than or to the melting of the solder.
3 more elements
Dependencies are inferred from the claim text.