Integrated circuit protection and ruggedization coatings and methods
AssigneeRockwell Collins, Inc.
InventorsNathan P. Lower, Ross K. Wilcoxon, Alan P. Boone
Life of this patent
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Abstract
An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.
Claims34
A method of forming an electronics package, comprising:
- providing a substrate;
- providing at least one integrated circuit die on the substrate;
- mixing an alkali silicate glass with a solvent, the alkali silicate glass produced from SiO2 and M2O, wherein M is an alkali metal;
- depositing the alkali silicate glass onto the integrated circuit die and the substrate after providing the at least one integrated circuit die on the substrate;
- and
- curing the alkali silicate glass to form a coating covering at least a portion of the integrated circuit die and at least a portion of the substrate.
A method of forming an electronics package, comprising:
- providing a substrate;
- providing at least one integrated circuit die on the substrate;
- mixing an alkali silicate glass material with water, the alkali silicate glass material produced from SiO2 and M2O, wherein M is an alkali metal;
- depositing the glass material as a coating onto the integrated circuit die and the substrate after providing the at least one integrated circuit die on the substrate;
- and
- curing the glass material, wherein the coating covers at least a portion of the integrated circuit die and at least a portion of the substrate.
A method of making an electronics package including a printed circuit board, at least one integrated circuit coupled to the printed circuit board, and an alkali silicate glass coating forming a hermetic seal around at least a portion of the at least one integrated circuit, the method comprising:
- providing the printed circuit board;
- providing the at least one integrated circuit on the printed circuit board;
- mixing an alkali silicate material with a solvent, the alkali silicate material produced from SiO2 and M2O, wherein M is an alkali metal;
- depositing the alkali silicate material onto the integrated circuit and printed circuit board after providing the at least one integrated circuit on the printed circuit board;
- and
- curing the alkali silicate material to form the alkali silicate glass coating covering at least a portion of the integrated circuit and at least a portion of the printed circuit board.
A method of forming an electronics package, including a substrate, at least one power dissipating die coupled to the substrate, and an alkali silicate glass coating forming a hermetic seal around at least a portion of the at least one power dissipating die, the method comprising:
- providing the substrate;
- providing the at least one power dissipating die on or over the substrate;
- mixing an alkali silicate material with a solvent, the alkali silicate material produced from SiO2 and M2O, wherein M is an alkali metal;
- depositing the alkali silicate material onto the power dissipating die after providing the at least one power dissipating die on or over the substrate;
- and curing the alkali silicate material to form a coating covering at least a portion of the power dissipating die and the substrate.
Dependencies are inferred from the claim text.