Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method
AssigneeSharp Kabushiki Kaisha
InventorsYuhzoh Tsuda, Shigetoshi Ito, Mototaka Taneya, Yoshihiro Ueta, Teruyoshi Takakura
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Abstract
The present invention includes a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen carrier gas and a hydrogen carrier gas of a flow quantity larger than that of the nitrogen carrier gas to thereby supply a raw material containing Mg and a Group V raw material containing N, and a second step of lowering a temperature by using a second carrier gas to which a material containing N is added, and hence solves the problems.
Claims8
A method of manufacturing a p-type nitride semiconductor comprising:
- a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen gas and a hydrogen gas of a flow quantity larger than a flow quantity of said nitrogen gas to thereby supply a raw material containing magnesium and a Group V raw material containing nitrogen (N);
- and
- a second step of lowering a temperature by using a second carrier gas to which a material containing nitrogen (N) is added of a concentration of at least 0.01% and less than 20%,
- Wherein ammonia is used at a concentration of at least 0.01% and at most 5% as said material containing nitrogen (N).
A method of manufacturing a p-type nitride semiconductor, comprising:
- a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen gas and a hydrogen gas of a flow quantity larger than a flow quantity of said nitrogen gas to thereby supply a raw material containing magnesium and a Group V raw material containing nitrogen (N);
- and
- a second step of lowering a temperature by using a second carrier gas to which a material containing nitrogen (N) is added at a concentration of at least 0.01% and less than 20%, wherein a flow quantity of the second carrier gas is larger than the flow quantity of the nitrogen gas in the first carrier gas.
A method of manufacturing a p-type nitride semiconductor, comprising:
- a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen gas and a hydrogen gas of a flow quantity larger than a flow quantity of said nitrogen gas to thereby supply a raw material containing magnesium and a Group V raw material containing nitrogen (N);
- and
- a second step of lowering a temperature by using a second carrier gas to which a material containing nitrogen (N) is added at a concentration of at least 0.01% and less than 20%, wherein said second step is a step of lowering the temperature to 400° C. or lower, and time required for reaching 400° C. is at most 25 minutes.
A method of manufacturing a p-type nitride semiconductor, comprising:
- a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen gas and a hydrogen gas of a flow quantity larger than a flow quantity of said nitrogen gas to thereby supply a raw material containing magnesium and a Group V raw material containing nitrogen (N);
- and
- a second step of lowering a temperature by using a second carrier gas to which a material containing nitrogen (N) is added at a concentration of at least 0.01% and less than 20%,
- Wherein dimethyl hydrazine is used at concentration at least 0.01% and at most 2% as said material containing nitrogen (N).
A method of manufacturing a p-type nitride semiconductor, comprising:
- a first step of forming a nitride semiconductor layer by metal organic chemical vapor deposition by using a first carrier gas containing a nitrogen gas and a hydrogen gas of a flow quantity larger than a flow quantity of said nitrogen gas to thereby supply a raw material containing magnesium and a Group V raw material containing nitrogen (N);
- a second step of lowering a temperature by using a second carrier gas to which a material containing nitrogen (N) is added at a concentration of at least 0.01% and less than 20%, and
- a third step of subjecting the nitride semiconductor layer to an annealing treatment after said step in an inert gas for at least one minute and at most 15 minutes.
Dependencies are inferred from the claim text.