Information recording medium and method for manufacturing the same
AssigneePanasonic Corporation
InventorsTakashi Nishihara, Yoshitaka Sakaue, Rie Kojima
Life of this patent
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Abstract
An information recording medium, 15 capable of recording information by irradiation of light or applying electrical energy, wherein at least one of first and second dielectric layers 102, 106, first interface layer and counter-incident side interface layer 103, 105 is formed from a Si—In—Zr/Hf—O-based material containing at least Si, In, M1 (M1 represents at least one element selected from among Zr and Hf) and oxygen (O), with Si content being 1 atomic % or more. This medium has high recording sensitivity when information is recorded thereon, high overwrite cycle-ability and high signal intensity.
Claims27
An information recording medium on and/or from which information can be recorded and/or reproduced by applying light or applying electrical energy, and which media comprises:
- at least one recording layer,
- at least one interface layer of a Si—In—Zr/Hf—O-based material comprising Si, In, M1 (M1 representing at least one element selected from among Zr and Hf) and oxygen (O), wherein the layer of Si—In—Zr/Hf—O-based material comprises 1 atomic % or more Si,
- at least one dielectric layer of a Si—In—Zr/Hf—O-based material comprising Si, In, M1 (M1 representing at least one element selected from among Zr and Hf) and oxygen (O), wherein the layer of Si—In—Zr/Hf—O-based material comprises 1 atomic % or more Si, and
- at least one reflective layer,
- wherein a layer of Si—In—Zr/Hf—O-based material as an interface layer, another layer of Si—In—Zr/Hf—O-based material as a dielectric layer and a reflective layer are stacked in this order on one surface of a recording layer, and
- a proportion of In occupying the Si—In—Zr/Hf—O-based material as an interface layer is larger than a proportion of In occupying the Si—In—Zr/Hf—O-based material as a dielectric layer, and/or
- a proportion of Si occupying the Si—In—Zr/Hf—O-based material as an interface layer is smaller than a proportion of Si occupying the Si—In—Zr/Hf—O-based material as a dielectric layer.
Dependencies are inferred from the claim text.