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US 8,075,853 B2Granted
Microchip
AssigneeRohm Co., Ltd.
InventorsHidetaka Okada, Yasuhisa Kageyama, Shun Momose, Youichi Aoki
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AssigneeRohm Co., Ltd.
InventorsHidetaka Okada, Yasuhisa Kageyama, Shun Momose, Youichi Aoki
Estimating the term…
The present invention provides a microchip which is made by bonding a first substrate having a groove provided at the substrate surface and a second substrate together, and has a fluid circuit therein, the fluid circuit having a separation portion for separating a first component, and a groove which constitutes the separation portion including an approximately V-shaped region surrounded by prescribed flow channel walls. At a top of the separation portion, a flow rate limiting portion limiting a flow rate of a fluid is preferably provided.
A microchip comprising a first substrate bonded to a second substrate and including a groove on its surface, the microchip further comprising:
A microchip comprising a first substrate bonded to a second substrate and including a groove on its surface, the microchip further comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Cuvette constructions: centrifugal type cuvettes
By integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g.…
Fluid handling related problems: metering of fluids
Fluid handling related problems: control of the sequence of chambers filled or emptied
About 2 years 7 months of term left · ends 9 Jun 2029 (estimated)
1. Field of the Invention
The present invention relates to a microchip useful as μ-TAS (Micro Total Analysis System) preferably used for a biochemical test of DNA, protein, a cell, immunity and blood, chemical synthesis and environmental analysis.
2. Description of the Background Art
FIG. 1 is a top plan view showing an example of a first substrate constituting a microchip according to a first embodiment of the present invention.
FIG. 2 is an enlarged diagram showing a peripheral region of a blood plasma separation portion shown in FIG. 1.
FIG. 3 is a schematic diagram showing a state where blood is introduced into the blood plasma separation portion shown in FIG. 1 and separated into a layer of a blood plasma component and a layer of a blood cell component by centrifugation.
A microchip according to this embodiment relates to a microchip having a fluid circuit therein, formed by bonding a second substrate onto a groove forming-side surface of a first substrate including a groove on the substrate surface. The fluid circuit is constituted of the groove formed on the surface of the first substrate and a bonded surface of the second substrate, and more specifically, the fluid circuit consists of a cavity portion constituted of the groove formed on the surface of the first substrate and the bonded surface of the second substrate. The dimensions of the microchip, not particularly restricted, can be set to about several cm in length and width and about several mm to 1 cm in thickness, for example.
In this embodiment, grooves may be provided on both surfaces of the first substrate, and in this case, the microchip is prepared by bonding the second substrate and a third substrate to hold the first substrate therebetween. The microchip employing such three substrates has two-layer fluid circuits including a fluid circuit constituted of a groove formed on the side of the first substrate closer to the second substrate and a bonded surface of the second substrate and another fluid circuit constituted of a groove formed on a side of the first substrate closer to the third substrate and a bonded surface of the third substrate. The two layers mean that the fluid circuits are provided on two positions different from each other in relation to the thickness direction of the microchip. Such two-layer fluid circuits can be connected with each other by a through-hole passing through the first substrate in the thickness direction.
A method of forming the groove constituting the fluid circuit on the surface of the first substrate is not particularly restricted, but injection molding employing a mold having a transfer structure or imprinting can be listed. When forming the substrate with an inorganic material, etching or the like can be employed.