Film removal method and apparatus
AssigneeIndustrial Technology Research Institute
InventorsChia-Chiang Chang, Chin-Jyi Wu, Chen-Der Tsai, Chun-Hung Lin
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Abstract
A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.
Claims6
A film removal method for removing a film from a substrate, comprising the steps of:
- disposing a plasma generator and a sucking apparatus above the substrate such that the principal axes of the plasma generator and the sucking apparatus are oriented at respective oblique angles with respect to the substrate;
- adjusting the plasma generator so as to project a plasma beam from the plasma generator onto the film at an oblique projection angle with respect to the substrate, so that the projected plasma beam has a reflection path at an oblique reflection angle with respect to the substrate;
- adjusting the sucking apparatus to orient the principal axis thereof along the reflection path so as to suck and remove a by-product of an incomplete plasma reaction occurring to the film to keep a surface of the substrate clean;
- rotating the plasma generator and the sucking apparatus about a rotation axis such that the plasma generator and the sucking apparatus are disposed on the opposite sides of the rotation axis, and
- moving the plasma generator and the sucking apparatus horizontally in relation to the substrate.
Dependencies are inferred from the claim text.