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AssigneeHenkel Corporation
InventorsQing Ji, Chew B. Chan, Hwang K. Yun, Renzhe Zhao, Weitong Shi
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This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55° C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.
A method of providing an underfill sealant between a semiconductor device or a semiconductor chip and a circuit board to which said semiconductor device or said semiconductor chip is electrically connected, and subsequently reacting said underfill sealant, reworking said underfill sealant, and removing said semiconductor device or said semiconductor chip from said circuit board after said semiconductor device or said semiconductor chip has failed, the steps of which comprise:
Dependencies are inferred from the claim text.