Processes for reconditioning multi-component electrodes

A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive aluminum-based backing plate, the process comprising:

• removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising approximately 70-90% water, approximately 10-20% hydrogen peroxide, and up to approximately 10% sulfuric acid, by volume, and rinsing the multi-component electrode with de-ionized water, wherein the electrical resistivity the de-ionized water is at least approximately 12 MΩ-cm and the temperature of the de-ionized water is approximately 20±5° C.;
• polishing one or more surfaces of the multi-component electrode following removal of metal ions there from, wherein the surface polishing is done under substantially continuous flow of de-ionized water presented at a temperature of approximately 20±5° C. and at a flow rate sufficient to inhibit elevation of the temperature of the de-ionized water beyond approximately 25° C. at the electrode surface;
• removing contaminants from silicon surfaces of the multi-component electrode by subjecting the multi-component electrode to an ultrasonic cleaning operation in de-ionized water prior to treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water, wherein the temperature of the de-ionized water used in the ultrasonic cleaning operation is approximately 20±5° C. and the ultrasonic power density of the de-ionized water used in the ultrasonic cleaning operation is between approximately 1.5 Watts/cm2 and approximately 3.1 Watts/cm2 at approximately 40 kHz.