Liquid ejecting head and liquid ejecting apparatus

A method of manufacturing a liquid ejecting head with wiring substrates electrically connected to lead electrodes in a liquid ejecting head member including a flow passage forming substrate that includes pressure generating chambers communicating with nozzles capable of ejecting a liquid provided therein, pressure generating elements capable of applying pressure which causes the liquid to the pressure generating chambers to be ejected from the nozzles, where the lead electrodes supply electric signals to the pressure generating elements, the method comprising:

• fixing the wiring substrates to a supporting member to support the wiring substrates;
• aligning the lead electrodes of the liquid ejecting head member with the wiring substrates;
• pressing connecting portions between the aligned lead electrodes and the wiring substrates so as to electrically connect the lead electrodes and the wiring substrates;
• and
• providing a buffer member at one end of the supporting member, such that a portion of the buffer member faces a region of the liquid ejecting head member where the wiring substrates and the lead electrodes are connected to each other.

A method of manufacturing a liquid ejecting head, the method comprising:

• forming a flow passage forming substrate including a plurality of pressure generating chambers which communicate with a plurality of nozzles capable of ejecting a liquid;
• forming a plurality of pressure generating elements which correspond to the plurality of pressure generating chambers which are capable of applying pressure to the liquid within the pressure generating chambers in order to cause the liquid to be ejected from the nozzles,
• forming a series of lead electrodes capable of supplying electric signals to each of the pressure generating elements;
• forming a supporting member on the flow passage forming substrate;
• fixing wiring substrates to the supporting member so to support the wiring substrates;
• aligning the lead electrodes of the liquid ejecting head member with the wiring substrates;
• pressing connecting portions between the aligned lead electrodes and the wiring substrates so as to electrically connect the lead electrodes and the wiring substrates;
• and
• providing a buffer member at one end of the supporting member, such that a portion of the buffer member faces the region of the liquid ejecting head where the wiring substrates and the lead electrodes are connected to each other.