Back to results
US 8,075,093 B2Granted
Pagewidth printhead assembly having LCP micromolding
AssigneeSilverbrook Research Pty Ltd
InventorsKia Silverbrook, Tobin Allen King
Life of this patent
Estimating the term…
Abstract
A pagewidth inkjet printhead assembly includes a printhead integrated circuit; an LCP ink manifold; and a flex PCB wire-bonded to bond pads on the printhead integrated circuit. The flex PCB wraps around the LCP ink manifold. The ink manifold includes an LCP lower micromolding having a plurality of ink inlets and an LCP upper micomolding having a plurality of ink outlets. The printhead integrated circuit is bonded to the LCP upper micromolding.
Claims8
A pagewidth inkjet printhead assembly comprising:
- at least one printhead integrated circuit;
- an LCP (liquid crystal polymer) ink manifold comprising an LCP lower micromolding having a plurality of ink inlets and an LCP upper micromolding having a plurality of ink outlets, said at least one printhead integrated circuit being bonded to said LCP upper micromolding;
- a flex PCB (printed circuit board) wire-bonded to bond pads on said at least one printhead integrated circuit, said flex PCB wrapping around said LCP ink manifold.
Dependencies are inferred from the claim text.