# US 8,069,584 B2 · Anti-static sole > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,069,584 B2 - Document ID: US8069584B2 - Status: Granted - Kind: B2 - Application number: 12/479,788 - Filed: 2009-06-06 - Published: 2010-08-19 - Granted: 2011-12-06 - Earliest claimed: 2009-02-13 - Assignees: New Process Corp. - Inventors: San-Huai Wang - Web page: https://patentgrep.com/patent/US8069584B2 ## CPC - A43B 7/36: with earthing or grounding means - A43B: CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR ## Abstract An anti-static sole is provided with a pad body between a midsole and an insole. In the pad body is provided a chip resistor. The chip resistor includes a connecting pin at each of two opposite ends thereof. The two connecting pins of the chip resistor are electrically connected to the insole and the midsole, respectively. Since the chip resistor has no exposed wires, damage to the wires is avoided. Further, the anti-static effect can be improved since the resistance of the chip resistor is stable. ## Claims ### Claim 1 An anti-static sole comprising: a midsole being conductive and provided with a first conductive element at a top surface thereof; a pad body having a bottom surface disposed at the top surface of the midsole and interiorly including a chip resistor, the chip resistor including a connecting pin at each of two opposite ends thereof, the two connecting pins being respectively located at a top surface and the bottom surface of the pad body, one of the two connecting pins being electrically connected to the first conductive element of the midsole; and an insole being disposed at the top surface of the midsole and cooperating with the midsole to clamp the pad body, the insole being provided with a second conductive element, the second conductive element having a first portion located at a top surface of the insole and a second portion located at a bottom surface of the insole, the second portion of the second conductive element located at the bottom surface of the insole being covered by the pad body and electrically connected to the other of the connecting pins of the chip resistor. ### Claim 2 (depends on 1) The anti-static sole as claimed in claim 1, wherein the first conductive element and the second conductive element are both made of conductive fabric. ### Claim 3 (depends on 1) The anti-static sole as claimed in claim 1, wherein the pad body includes a main pad and the chip resistor, the main pad includes a through hole, and the chip resistor is received in the through hole. ### Claim 4 (depends on 1) The anti-static sole as claimed in claim 1, wherein the chip resistor of the pad body includes a packaging layer and the two connecting pins, the packaging layer includes an inner resistive circuit, the two connecting pins are disposed at and abutted against two opposite ends of the packaging layer, and the two connecting pins are electrically connected to the resistive circuit, respectively. ### Claim 5 (depends on 1) The anti-static sole as claimed in claim 1, wherein the pad body includes a main pad, an assistant pad, an upper conductive fabric, a lower conductive fabric and the chip resistor, the main pad includes a through hole, the assistant pad is disposed at a bottom surface of the main pad, the assistant pad includes a receiving hole, the through hole of the main pad is in alignment with the receiving hole of the assistant pad, the chip resistor is received in both the through hole and the receiving hole, one of the two connecting pins is exposed from a top surface of the main pad, and the other of the two connecting pins is exposed from a bottom surface of the assistant pad, the upper conductive fabric is disposed at the top surface of the main pad and covers a corresponding connecting pin of the chip resistor in such a manner that the upper conductive fabric is in electrical contact with this connecting pin, the lower conductive fabric is disposed at the bottom surface of the assistant pad and covers a corresponding connecting pin of the chip resistor in such a manner that the lower conductive fabric is in electrical contact with this connecting pin, the upper conductive fabric is in electrical contact with the second conductive element of the insole. ### Claim 6 (depends on 1) The anti-static sole as claimed in claim 1, wherein the second conductive element of the insole includes a first segment and a second segment at the top surface of the insole and a third segment at the bottom surface of the insole, the third segment of the second conductive element is covered by the pad body and electrically connected to a corresponding connecting pin of the chip resistor. ### Claim 7 (depends on 6) The anti-static sole as claimed in claim 6, wherein two ends of the second conductive element penetrate to the top surface of the insole from the bottom surface thereof in such a manner that the two ends of the second conductive element form the first segment and the second segment, respectively, and a middle portion of the second conductive element forms the third segment. ### Claim 8 (depends on 6) The anti-static sole as claimed in claim 6, wherein two ends of the second conductive element of the insole are wound from the bottom surface of the insole to the top surface of the insole in such a manner that the two ends of the second conductive element form the first and the second segments, respectively, and a middle portion of the second conductive element forms the third segment. ### Claim 9 An anti-static shoe comprising: a midsole being conductive and provided with a first conductive element at a top surface thereof; a pad body having a bottom surface disposed at the top surface of the midsole and interiorly including a chip resistor, the chip resistor including a connecting pin at each of two opposite ends thereof, the two connecting pins being respectively located at a top surface and the bottom surface of the pad body, one of the two connecting pins being electrically connected to the first conductive element of the midsole; an insole being disposed at the top surface of the midsole and cooperating with the midsole to clamp the pad body, the insole being provided with a second conductive element, the second conductive element having a first portion located at a top surface of the insole and a second portion located at a bottom surface of the insole, the second portion of the second conductive element located at the bottom surface of the insole being covered by the pad body and electrically connected to the other of the connecting pins of the chip resistor; and a shoe upper being disposed at the top surfaces of the midsole and the insole and covering the insole. ### Claim 10 (depends on 9) The anti-static shoe as claimed in claim 9, wherein the first conductive element and the second conductive element are both made of conductive fabric. ### Claim 11 (depends on 9) The anti-static shoe as claimed in claim 9, wherein the pad body includes a main pad and the chip resistor, the main pad includes a through hole, and the chip resistor is received in the through hole. ### Claim 12 (depends on 9) The anti-static shoe as claimed in claim 9, wherein the chip resistor of the pad body includes a packaging layer and the two connecting pins, the packaging layer includes an inner resistive circuit, the two connecting pins are disposed at and abutted against two opposite ends of the packaging layer, and the two connecting pins are electrically connected to the resistive circuit, respectively. ### Claim 13 (depends on 9) The anti-static shoe as claimed in claim 9, wherein the pad body includes a main pad, an assistant pad, an upper conductive fabric, a lower conductive fabric and the chip resistor, the main pad includes a through hole, the assistant pad is disposed at a bottom surface of the main pad, the assistant pad includes a receiving hole, the through hole of the main pad is in alignment with the receiving hole of the assistant pad, the chip resistor is received in both the through hole and the receiving hole, one of the two connecting pins is exposed from a top surface of the main pad, and the other of the two connecting pins is exposed from a bottom surface of the assistant pad, the upper conductive fabric is disposed at the top surface of the main pad and covers a corresponding connecting pin of the chip resistor in such a manner that the upper conductive fabric is in electrical contact with this connecting pin, the lower conductive fabric is disposed at the bottom surface of the assistant pad and covers a corresponding connecting pin of the chip resistor in such a manner that the lower conductive fabric is in electrical contact with this connecting pin, the upper conductive fabric is in electrical contact with the second conductive element of the insole. ### Claim 14 (depends on 9) The anti-static shoe as claimed in claim 9, wherein the second conductive element of the insole includes a first segment and a second segment at the top surface of the insole and a third segment at the bottom surface of the insole, the third segment of the second conductive element is covered by the pad body and electrically connected to a corresponding connecting pin of the chip resistor. ### Claim 15 (depends on 14) The anti-static shoe as claimed in claim 14, wherein two ends of the second conductive element penetrate to the top surface of the insole from the bottom surface thereof in such a manner that the two ends of the second conductive element form the first segment and the second segment, respectively, and a middle portion of the second conductive element forms the third segment. ### Claim 16 (depends on 14) The anti-static sole as claimed in claim 14, wherein two ends of the second conductive element of the insole are wound from the bottom surface of the insole to the top surface of the insole in such a manner that the two ends of the second conductive element form the first and the second segments, respectively, and a middle portion of the second conductive element forms the third segment.