Heat dissipation device

A heat dissipation device adapted for dissipating heat from an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

• a fin unit;
• a heat-conducting board for being attached to the electronic component, the heat-conducting board comprises
• a pair of engaging portions, each of the pair of engaging portions comprises an upright section protruding upwardly from a top face of the heat-conducting board,
• a hooking section extending horizontally from an upper end of the upright section, the hooking section of the each of the pair of engaging portions extends towards each other, and
• two elongated engaging holes are aligned with the pair of engaging portions;
• a heat pipe thermally connecting the fin unit and the heat-conducting board, the heat pipe extends between the two elongated engaging holes and the pair of engaging portions of the heat-conducting board;
• and
• a clip securing the heat pipe to the top face of the heat-conducting board, the clip comprising
• a pivoting portion which is pivotally fixed to the two elongated engaging holes of the heat-conducting board,
• a clasping portion detachably engaging with the pair of engaging portions, and
• a main body interconnecting the pivoting portion with the clasping portion, the main body spanning the heat pipe and urging the heat pipe towards the heat-conducting board, the main plate comprises a plate spanning a top face of the heat pipe, a front sidewall extending downwardly from a front lateral side of the plate, and a rear sidewall extending downwardly from a rear lateral side of the plate.