Methods and systems for magnetic sensing
AssigneeInfineon Technologies AG
InventorJames William Sterling
Life of this patent
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Abstract
One embodiment relates to a method of manufacturing a magnetic sensor. In the method, an engagement surface is provided. A magnet body is formed over the engagement surface by gradually building thickness of a magnetic material. The magnet body has a magnetic flux guiding surface that substantially corresponds to the engagement surface. Other apparatuses and methods are also set forth.
Claims33
A method for forming a magnetic sensor, comprising
- providing an engagement surface;
- depositing an epoxy layer on the engagement surface, a surface of the epoxy layer formed having three planar surfaces;
- and
- forming a magnet body over the engagement surface and on the epoxy layer by gradually building thickness of a magnetic material, the magnet body having a magnetic flux guidance surface having three planar surfaces and being substantially v-shaped to facilitate perpendicular guidance of magnetic field lines.
A method for forming a magnetic sensor, comprising:
- providing an integrated circuit that comprises at least one sensing element;
- forming an integrated circuit package over the integrated circuit, where the integrated circuit package comprises an engagement surface that facilitates alignment of a magnet body relative to the at least one sensing element;
- and
- forming a magnetic flux guidance surface having three planar surfaces and being substantially v-shaped over the engagement surface.
A method for manufacturing a magnetic sensor, comprising:
- providing a lead frame that comprises:
- a die area and an engagement surface separated from one another by a bendable member;
- providing a magnet body over the engagement surface;
- bending the bendable member so the magnet body is positioned over or under the die area.
A magnetic sensor, comprising
- an integrated circuit comprising at least one sensing element;
- an integrated circuit package overlying the integrated circuit, wherein the integrated circuit package comprises an engagement surface that facilitates alignment of a magnet body relative to the at least one sensing element;
- and
- a magnetic flux guidance surface having three planar surfaces and being substantially v-shaped on the engagement surface.
A magnetic sensor, comprising
- an integrated circuit comprising at least one sensing element;
- an integrated circuit package overlying the integrated circuit, wherein the integrated circuit package comprises an engagement surface;
- an epoxy layer formed over the engagement surface of the integrated circuit package;
- and
- a magnet body overlying the engagement surface and the epoxy layer, where the magnet body has a magnetic flux guiding surface that substantially corresponds to the engagement surface, the magnetic flux guiding surface having three planar surfaces and being substantially v-shaped.
A magnetic sensor, comprising
- an integrated circuit comprising at least one sensing element;
- a magnet body comprising a magnetic flux guiding surface that is adapted to guide magnetic field lines in a predetermined manner with respect to the at least one sensing element, the magnetic flux guiding surface having three planar surfaces and being substantially v-shaped;
- and
- an integrated circuit package overlying the integrated circuit and magnet body.
Dependencies are inferred from the claim text.