Substrate processing system and substrate transfer method

A substrate processing system for performing a process including a photolithography sequence on target substrates, the substrate processing system comprising:

• a first automated substrate transfer line configured to transfer the target substrates among a plurality of process sections for respectively performing processes on the target substrates;
• a first automated substrate transfer unit configured to travel on the first automated substrate transfer line and to transfer the target substrates to and from the respective process sections, the first automated substrate transfer unit being a container transfer unit configured to transfer a first container with a plurality of target substrates stored therein;
• a photolithography process section configured to perform a series of processes in the photolithography sequence and connected to the first automated substrate transfer line so as for the target substrates to be transferred therebetween;
• and
• a second automated substrate transfer line configured to transfer the target substrates among respective process apparatuses in the photolithography process section, the second automated substrate transfer line being a cyclical substrate transfer line having a loop path to transfer the target substrates to and from the plurality of process sections, said cyclical substrate transfer line independent of the first automated substrate transfer line,
• wherein the photolithography process section comprises
• a resist coating process apparatus configured to coat a surface of each of the target substrates with a resist,
• a light exposure process apparatus configured to perform a light exposure process on the resist on each of the target substrates,
• a post-light-exposure baking process apparatus configured to perform a heat process on the resist after the light exposure process, and
• a developing process apparatus configured to perform a developing process on the resist after the heat process,
• such that the resist coating process apparatus and the developing process apparatus are disposed separately from each other and each directly connected to the second automated substrate transfer line so as for the target substrates to be transferred therebetween, and the light exposure process apparatus is connected to the second automated substrate transfer line through the post-light-exposure baking process apparatus and the developing process apparatus so as for the target substrates to be transferred between the second automated substrate transfer line and the light exposure process apparatus through the post-light-exposure baking process apparatus and the developing process apparatus.