Method and device for packaging a substrate
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsLauren Palmateer, William J. Cummings, Brian Gally, Mark Miles, Jeffrey B. Sampsell, Clarence Chui, Manish Kothari
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Abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
Claims20
A method of manufacturing a display, the method comprising:
- providing an electro-mechanical device, wherein said electro-mechanical device comprises a first sacrificial layer;
- depositing a second sacrificial layer over said electro-mechanical device, wherein said second sacrificial layer is exposed to a portion of said first sacrificial layer;
- depositing a thin film backplane over and in contact with said second sacrificial layer, wherein the thin film backplane has an opening;
- and
- after depositing the thin film backplane, removing said first and said second sacrificial layers,
- wherein at least a part of said first sacrificial layer is removed concurrently with at least a part of said second sacrificial layer,
- wherein removing said second sacrificial layer provides a gap above said electro-mechanical device and below said thin film backplane.
A method of manufacturing a display comprising a plurality of electro-mechanical devices, the method comprising:
- providing an electro-mechanical device, wherein said electro-mechanical device comprises:
- a first sacrificial layer;
- and
- a first opening into said electro-mechanical device exposing said sacrificial layer;
- providing a thin film backplane over said electro-mechanical device, wherein the thin film backplane comprises a second opening;
- providing a second sacrificial layer between said thin film backplane and said electro-mechanical device;
- introducing a release material through said first and second openings to release the first sacrificial layer and second sacrificial layer, and
- wherein at least a part of said first sacrificial layer is removed concurrently with at least a part of said second sacrificial layer.
A display device, comprising:
- a transparent substrate;
- an interferometric modulator disposed on the transparent substrate, said interferometric modulator comprising:
- a first sacrificial layer;
- and
- a first opening exposing said first sacrificial layer;
- and
- a thin film backplane sealing said interferometric modulator within a package between said transparent substrate and said thin film backplane,
- wherein a second sacrificial layer is positioned between said thin film backplane and said interferometric modulator and contacts said first sacrificial layer exposed at said first opening, and
- wherein a second opening exists in said thin film backplane.
Dependencies are inferred from the claim text.