Method and apparatus for inspecting defect of pattern formed on semiconductor device
AssigneeHitachi High-Technologies Corporation
InventorsTomofumi Nishiura, Atsushi Miyamoto, Chie Shishido, Takumichi Sutani
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AssigneeHitachi High-Technologies Corporation
InventorsTomofumi Nishiura, Atsushi Miyamoto, Chie Shishido, Takumichi Sutani
Estimating the term…
In the inspection apparatus for a defect of a semiconductor and the method using it for automatically detecting the defect on a semiconductor wafer and presuming the defect occurrence factor using the circuit design data, a plurality of shapes are formed from the circuit design data by deforming the design data with respect to shape deformation items stipulated for respective defect occurrence factor for comparison with the inspection object circuit pattern. The defect is detected by comparison of the group of shapes formed and the actual pattern. Further, the occurrence factors of these defects are presumed, and the defects are classified according to respective factor.
An apparatus for inspecting a defect of a circuit pattern formed on a semiconductor wafer comprising:
A method for inspecting a defect of a circuit pattern formed on a semiconductor wafer comprising the steps of:
Dependencies are inferred from the claim text.