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US 8,045,331 B2Granted
Printed circuit board, method of fabricating the same, and electronic apparatus employing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Seong Seo, Young-Min Lee, Kyu-Sub Kwak
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.
Claims11
A printed circuit board comprising:
- a core layer,
- an insulation layer formed on the core layer having a cavity, and
- a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals substantially positioned above the cavity.
A method of fabricating a printed circuit board comprising the steps of:
- forming a core layer and a conductive pattern on the core layer,
- forming an insulation layer on the core layer,
- removing at least a portion of the insulation layer, thereby forming a cavity,
- filling the cavity with a filler member,
- forming a circuit pattern on the filler member and the insulation layer, the circuit pattern consisting of internal and external terminals, and
- removing at least a portion of the filler member such that at least one external terminal is substantially positioned over the removed portion.
3 more elements
An electronic apparatus comprising:
- at least one housing, and
- a printed circuit board mounted in the housing, wherein the printed circuit board comprises an insulation layer with a cavity, at least one internal terminal formed on the insulation layer, and at least one external terminal substantially positioned over the cavity.
Dependencies are inferred from the claim text.