Apparatus for detecting defects using multiple coordinate systems

An apparatus for processing each inspected data obtained by inspections using a plurality of inspection apparatuses, comprising:

• a data processing unit configured to receive position information on a first defects group detected, relative to a first position standard on a sample, by detecting the first defects group on the sample by inspecting the sample under a first condition by a first defect inspection apparatus, and receives position information on a second defects group detected, relative to a second standard on the sample, by detecting the second defects group on the sample by inspecting the sample under a second condition by a second defect inspection apparatus which is different from the first defect inspection apparatus, the position information on the second defects group being received after at least one wafer processing step has been performed on the sample;
• said data processing unit being further configured to calculate a misalignment amount between the first position standard and the second position standard, using position information on the first defects group, relative to the first position standard, and position information on the second defects group, relative to the second position standard;
• said data processing unit including:
• a position correction unit configured to correct position information on the first defects group and/or position information on the second defects group, based on the calculated misalignment amount, and
• a defects checking unit which checks the first defects group and the second defects group, having the position information corrected;
• and
• an output unit which outputs the checked results.