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US 8,045,026 B2Granted
Solid-state image sensing device
AssigneeKabushiki Kaisha Toshiba
InventorJunichi Abe
Life of this patent
Estimating the term…
Abstract
In a solid-state image sensing device, a second substrate having transparency, including a via is placed on a solid-state image sensor having a pixel region and a logic region formed in a first substrate and in which a passive component electrically connected with the solid-state image sensor through the via is mounted on the second substrate. Thus, highly efficient location of passive components is attained for miniaturization.
Claims13
A camera module comprising:
- a solid-state image sensor having a pixel region and a logic region;
- a first substrate having transparency, placed over the solid-state image sensor, and having a via located over the logic region;
- a first passive component mounted on the first substrate over the logic region and the first passive component electrically connected with the solid-state image sensor through the via;
- an optical lens disposed over the first substrate and the optical lens separated from the first substrate;
- and
- a lens holder mounted on the first substrate, the lens holder configured to retain the optical lens.
3 more elements
Dependencies are inferred from the claim text.