Semiconductor device

A semiconductor device comprising:

• a first substrate;
• a pixel portion over the first substrate;
• a second substrate over the pixel portion;
• a driving circuit over the first substrate;
• a layer comprising an integrated circuit over the driving circuit;
• and
• a FPC (flexible printed circuit) over the first substrate;
• wherein the pixel portion, the driving circuit, the layer, and the FPC (flexible printed circuit) are electrically connected to each other,
• wherein the driving circuit and the layer are connected via a bump,
• wherein the second substrate does not overlap the driving circuit, and
• wherein the layer does not overlap the FPC (flexible printed circuit).

A semiconductor device comprising:

• a first substrate;
• a pixel portion over the first substrate;
• a second substrate over the pixel portion;
• a driving circuit over the first substrate;
• a first layer comprising a first integrated circuit over the driving circuit;
• a second layer comprising a second integrated circuit over the first layer;
• and
• a FPC (flexible printed circuit) over the first substrate,
• wherein the driving circuit and the first layer are connected via a bump,
• wherein the pixel portion, the driving circuit, the first layer, the second layer, and the FPC (flexible printed circuit) are electrically connected to each other, and
• wherein the first layer and the second layer do not overlap the FPC (flexible printed circuit).

A semiconductor device comprising:

• a first substrate;
• a pixel portion over the first substrate;
• a second substrate over the pixel portion;
• a driving circuit over the first substrate;
• a first layer comprising a first integrated circuit over the driving circuit;
• a second layer comprising a second integrated circuit over the first layer;
• and
• a FPC (flexible printed circuit) over the first substrate,
• wherein the driving circuit and the first layer are connected via a bump,
• wherein the pixel portion, the driving circuit, the first layer, the second layer, and the FPC (flexible printed circuit) are electrically connected to each other,
• wherein the second substrate does not overlap the driving circuit, and
• wherein the first layer and the second layer do not overlap the FPC (flexible printed circuit).