Method and system for calibrating measurement tools for semiconductor device manufacturing

A method for calibrating a plurality of metrology tools, the method comprising:

• obtaining a first plurality of calibration standard wafers, that are associated with a plurality of predetermined values and calibrated against at least a first standard associated with a first worldwide acceptable origin;
• measuring the first plurality of calibration standard wafers by a plurality of metrology tools to obtain a first plurality of measured values;
• processing information associated with the first plurality of measured values;
• selecting a first metrology tool from the plurality of metrology tools based on at least information associated with the first plurality of measured values;
• calibrating the first metrology tool with a second plurality of calibration standard wafers that are calibrated against at least a second standard associated with a second worldwide acceptable origin;
• obtaining a plurality of working standard wafers;
• measuring the plurality of working standard wafers by the first metrology tool to obtain a second plurality of measured values, each of the second plurality of measured values corresponding to one of the plurality of working standard wafers;
• and
• calibrating a second metrology tool of the plurality of metrology tools with the plurality of working standard wafers associated with the second plurality of measured values.

A method for calibrating a plurality of metrology tools, the method comprising:

• obtaining a first plurality of calibration standard wafers that are associated with a plurality of predetermined values;
• measuring the first plurality of calibration standard wafers by a plurality of metrology tools to obtain a first plurality of measured values;
• processing information associated with the first plurality of measured values;
• determining a plurality of uncertainties for the plurality of metrology tools based on information associated with the first plurality of measured values;
• selecting a first metrology tool from the plurality of metrology tools based on at least information associated with the plurality of uncertainties;
• calibrating the first metrology tool with the first plurality of calibration standard wafers;
• obtaining a plurality of working standard wafers;
• measuring the plurality of working standard wafers by the first measurement system to obtain a second plurality of measured values;
• and
• calibrating a second metrology tool of the plurality of metrology tools with the plurality of working standard wafers associated with the second plurality of measured values.