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US 8,044,585 B2Granted
Light emitting diode with bumps
AssigneeChain Technology Consultant Inc.
InventorMing-Hsien Shen
Life of this patent
Estimating the term…
Abstract
A light-emitting diode includes a package, a light-emitting diode chip and a lens. The light-emitting diode chip is mounted on the package. The lens is mounted on the package and envelops the light-emitting diode chip, wherein the lens has a plane region surrounding the package and a bumpy region with a plurality of bumps fully arranged thereon adjacent to the plane region.
Claims7
A light-emitting diode comprising:
- a package;
- a light-emitting diode chip mounted on the package;
- and
- a lens mounted on the package and enveloping the light-emitting diode chip, wherein the lens comprises a bumpy region opposite the light-emitting diode chip, the bumpy region comprises a plurality of bumps arranged thereon side by side and in a scaly pattern, and each of the bumps comprises a curved surface, wherein central bumps of the bumps are higher and longer than outer bumps of the bumps, and the curved surface of each bump is a convex surface.
1 more element
A light-emitting diode having a package, a light-emitting diode chip mounted on the package and a lens mounted on the package and enveloping the light-emitting diode chip, wherein the improvement comprising:
- the lens has a plurality of bumps arranged on the lens and facing the inside of the light-emitting diode, wherein the bumps are arranged side by side and in a scaly pattern, and each of the bumps comprises a curved surface, wherein central bumps of bumps of the bumps are higher and longer than outer bumps of the bumps, and the curved surface of each bump is a convex surface.
Dependencies are inferred from the claim text.