Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor

A SAW device comprising:

• a piezoelectric substrate having a surface thereon;
• a plurality of metal electrodes on the surface of the piezoelectric substrate;
• and
• a dielectric layer on the surface of the piezoelectric substrate resulting from depositing the dielectric layer sufficient to cover the metal electrodes,
• wherein the depositing forms seams extending upward from electrodes,
• and wherein a third seam resulting from one seam extending from one electrode joining a second seam extending from an adjacent electrode within the dielectric layer and generally above the electrodes is substantially removed from the dielectric layer.

An acoustic wave device comprising:

• a piezoelectric substrate having a surface thereon;
• a plurality of metal electrodes on the surface of the piezoelectric substrate;
• and
• a dielectric layer on the surface of the piezoelectric substrate resulting from depositing the dielectric layer onto the substrate sufficient to cover the metal electrodes, wherein the depositing forms seams extending upward from the electrodes extending above the surface of the substrate.