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US 8,044,524 B2Granted
Adhesive for connection of circuit member and semiconductor device using the same
AssigneeHitachi Chemical Company, Ltd.
InventorAkira Nagai
Life of this patent
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Abstract
An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
Claims13
A semiconductor device comprising:
- (i) an electronic component comprising a semiconductor chip having protruding connecting terminals;
- and
- (ii) a board having wiring patterns formed thereon, wherein the electronic component and the board are electrically connected by an adhesive,
- wherein the adhesive is interposed between the semiconductor chip and the board for electrically connecting the protruding connecting terminals and the wiring patterns facing each other, and for bonding the semiconductor chip and the board by applying pressure/heat,
- wherein the adhesive comprises:
- (a) a resin composition comprising a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin;
- and
- (b) composite oxide particles having a refractive index between 1.5 to 1.7 comprising cordierite particles dispersed in the resin composition.
5 more elements
Dependencies are inferred from the claim text.